EP3SE260H780I4LG vs EP3SE50F780I4LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4LG sa pamamagitan ng Intel at EP3SE50F780I4LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260H780I4LG | EP3SE50F780I4LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix III Enhanced | Stratix III E |
| Family | EP3SE260 | Stratix III |
| Logic Elements | 255,000 LE | 47,500 |
| Adaptive Logic Modules (ALMs) | 102,000 ALM | 19,000 |
| Embedded Memory | 15.90 Mbit | 5.49 Mbit |
| DSP Blocks | 304 | Yes (dedicated, count not in source data) |
| 18x18 Multipliers | 840 | — |
| User I/O | 488 | — |
| PLLs | 8 (4 fractional + 4 general-purpose) | — |
| Speed Grade | -4 | — |
| Temperature Grade | Industrial (I) | — |
| Packhaging | 780-ball FineLine BGA (HBGA) | 780-ball FCBGA (FBGA-780) |
| Temperature na Operasyon | -40C to +100C | — |
| Process Technology | 65 nm low-power CMOS | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel / Active Serial | — |
| Maximum User I/Os | — | 488 |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Uri ng Pagpapasok | — | Surface Mount |
| Hanay ng Temperature na Operasyon | — | -40 C to +100 C |
| Process Node | — | 65 nm |
| High-Speed Transceivers | — | Multi-gigabit, count not in source data |
| Lead-Free / RoHS | — | Yes (G suffix = Pb-free) |
| Packaging | — | Tray |
| Uri ng Memory | — | Embedded SRAM block RAM |