EP3SE50F484C2N vs EP3SE50F484C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484C2N sa pamamagitan ng Intel at EP3SE50F484C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484C2N | EP3SE50F484C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Series | Stratix III E | — |
| Family | Stratix III E FPGA | Stratix III E |
| Logic Elements | 47,500 | — |
| Embedded Memory | 2,304 Kbits | — |
| DSP Blocks (18x18) | 264 | — |
| User I/Os | 296 | 296 |
| LABs/CLBs | 1,900 | — |
| Core Voltage | 0.9 V / 1.1 V | — |
| Internal Frequency | 600 MHz | — |
| Process Technology | 65 nm | TSMC 40 nm low-power CMOS |
| Packhaging | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) | 484-ball FBGA (FCBGA), 1.0 mm pitch |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85 C (commercial, C suffix) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Lead-free (per DigiKey listing) |
| Lead-Free | Yes | — |
| Device Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Adaptive Logic Modules (ALMs) | — | 18,750 |
| Embedded Memory (Bits) | — | 5,760,000 |
| Maximum Internal Frequency | — | 717 MHz (typical); 800 MHz per DigChip |
| Volte ng Pagbibigay | — | Core and I/O voltages per Stratix III E datasheet |
| Level ng MSL | — | 3 (per JEDEC J-STD-020 for FCBGA packages) |
| Configuration Mode | — | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG |
| Design Software | — | Intel Quartus II (Stratix III support) |
| Katayuan ng Lifecycle | — | Obsolete (per Worldway listing 2026-04-05) |