EP3SE50F484C2N vs EP3SE50F484C3N 比較

詳細並排比較 EP3SE50F484C2N 由 Intel 與 EP3SE50F484C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F484C2N EP3SE50F484C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND Obsolete
Series Stratix III E —
Family Stratix III E FPGA Stratix III E
Logic Elements 47,500 —
Embedded Memory 2,304 Kbits —
DSP Blocks (18x18) 264 —
User I/Os 296 296
LABs/CLBs 1,900 —
Core Voltage 0.9 V / 1.1 V —
Internal Frequency 600 MHz —
Process Technology 65 nm TSMC 40 nm low-power CMOS
封裝 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) 484-ball FBGA (FCBGA), 1.0 mm pitch
工作溫度 0C to +85C (Commercial) 0C to +85 C (commercial, C suffix)
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
RoHS 狀態 Compliant Lead-free (per DigiKey listing)
Lead-Free Yes —
Device Logic Elements — 47,500
Logic Array Blocks (LABs) — 1,900
Adaptive Logic Modules (ALMs) — 18,750
Embedded Memory (Bits) — 5,760,000
Maximum Internal Frequency — 717 MHz (typical); 800 MHz per DigChip
供應電壓 — Core and I/O voltages per Stratix III E datasheet
MSL 等級 — 3 (per JEDEC J-STD-020 for FCBGA packages)
Configuration Mode — Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG
Design Software — Intel Quartus II (Stratix III support)
生命週期狀態 — Obsolete (per Worldway listing 2026-04-05)

資料表與資源

瀏覽所有產品 建立 BOM 索取報價