EP3SE50F484I3 vs EP3SL50F484I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484I3 sa pamamagitan ng Intel at EP3SL50F484I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484I3 | EP3SL50F484I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix III E | Stratix III L |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Embedded Memory | 5,760 Kbits | 2,184,192 bits (2.1 Mbit) |
| User I/Os | 296 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 1.1 V | 0.9 V / 1.1 V |
| Packhaging | 484-ball FCBGA (FineLine BGA), 1.0 mm pitch | 484-ball FBGA (FC-FBGA, 23x23 mm, 1.0 mm pitch) |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | I3 (-3 speed bin, industrial) | — |
| DSP Blocks | Yes (embedded multipliers and accumulators) | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| PLLs | Yes (multiple, for clock management) | — |
| I/O Standards | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X | — |
| Transceivers | Multi-gigabit transceivers supported | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (SMT) |
| Tindminan RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Embedded 18x18 Multipliers | — | 218 |
| Maximum User I/O | — | 296 |
| Maximum Core Frequency | — | 500 MHz |
| Temperature ng Junction na Operasyon | — | -40C to +100C (Industrial) |
| Lead-Free / RoHS | — | Lead Free / Compliant |
| Level ng MSL | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |
| Programming Tool | — | Quartus II (legacy) |