EP3SE50F484I3N vs EP3SE50F484I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484I3N sa pamamagitan ng Intel at EP3SE50F484I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F484I3N | EP3SE50F484I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements | 47,500 | — |
| Number of LABs | 1,900 | — |
| Total Memory Bits | 5,760,000 | — |
| Maximum User I/O | 296 | 296 |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage VCC | 0.9 V | — |
| Auxiliary Voltage VCCAUX | 1.1 V | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Internal Frequency | 500 MHz | — |
| Speed Grade | I3 (industrial, bin 3) | — |
| Temperature na Operasyon | -40C to +100C (industrial) | — |
| Packhaging | 484-pin FC-FBGA (flip-chip BGA) | 484-ball FC-FBGA |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Configuration Method | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) | — |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: number of 18x18 multipliers] | — |
| Transceiver Count | [DATA_NEEDED: number of embedded transceivers] | — |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LAB) | — | 1,900 |
| Embedded Memory (Bits) | — | 5,760,000 |
| DSP Blocks (18x18 Multipliers) | — | 216 |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 450 MHz |
| Package Code | — | BBGA / FC-FBGA |
| Temperature / Speed Grade | — | I4 (Industrial) |
| Temperature ng Junction na Operasyon | — | -40 C to +100 C |
| Tindminan RoHS | — | Compliant |