EP3SE50F484I3N vs EP3SE50F484I4 比較

詳細並排比較 EP3SE50F484I3N 由 Intel 與 EP3SE50F484I4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F484I3N EP3SE50F484I4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III E Stratix III E (Enhanced)
Logic Elements 47,500 —
Number of LABs 1,900 —
Total Memory Bits 5,760,000 —
Maximum User I/O 296 296
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Core Voltage VCC 0.9 V —
Auxiliary Voltage VCCAUX 1.1 V —
Process Technology 65 nm 65 nm CMOS
Maximum Internal Frequency 500 MHz —
Speed Grade I3 (industrial, bin 3) —
工作溫度 -40C to +100C (industrial) —
封裝 484-pin FC-FBGA (flip-chip BGA) 484-ball FC-FBGA
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
Lead-Free / RoHS Yes (N suffix) —
Configuration Method Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Embedded Multipliers (18x18) [DATA_NEEDED: number of 18x18 multipliers] —
Transceiver Count [DATA_NEEDED: number of embedded transceivers] —
Logic Elements (LE) — 47,500
Logic Array Blocks (LAB) — 1,900
Embedded Memory (Bits) — 5,760,000
DSP Blocks (18x18 Multipliers) — 216
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
Package Code — BBGA / FC-FBGA
Temperature / Speed Grade — I4 (Industrial)
工作接面溫度 — -40 C to +100 C
RoHS 狀態 — Compliant

資料表與資源

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