EP3SE50F484I4LN vs EP3SE50F484I4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484I4LN sa pamamagitan ng Intel at EP3SE50F484I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE50F484I4LN EP3SE50F484I4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family Stratix III E —
Logic Elements (LE) 47,500 47,500
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory 5.76 Mbit (estimated from 47.5K LE family) —
User I/O Count 296 —
Process Node 65 nm —
Core Voltage (VCCINT) 0.9 V —
Auxiliary Voltage (VCCAUX) 1.1 V —
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V (bank-dependent) —
Packhaging 484-ball FBGA (FineLine BGA) 484-ball FC-FBGA (F484)
Pin/Pitch 484 balls, 1.0 mm pitch —
Temperature na Operasyon -40C to +100C (industrial I4 grade) 0 C to +85 C (Industrial)
Configuration SRAM-based (external flash/EPCS required) —
Tindminan RoHS Compliant (LN suffix indicates lead-free) —
Lead-Free Yes (LF / N suffix indicates lead-free) —
Transceivers 0 (F484 package does not include transceiver banks) —
PLL Count Up to 12 (estimated for Stratix III E family) —
DSP Blocks (18x18 Multipliers) [DATA_NEEDED: DSP block count] —
Design Tool Quartus II (legacy, support via Altera/Intel subscription) —
Device Family — Stratix III E
Adaptive Logic Modules (ALMs) — 19,000
Embedded Memory (TriMatrix) — 2,136 Kbits
Embedded Multipliers (18x18) — 384
User I/Os — 296
I/O Banks — 12
PLLs — 8
Global Clock Networks — 16
Maximum User I/O Frequency — 800 MHz (per DigChip datasheet summary)
Process Technology — 65 nm CMOS
Core Voltage — 1.1 V
Speed Grade — I4
Lead-Free / RoHS — Lead-free (per ampheo listing)

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