EP3SE50F780C2 vs EP3SE80F780C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C2 sa pamamagitan ng Intel at EP3SE80F780C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F780C2 | EP3SE80F780C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 47,500 | — |
| LABs / CLBs | 1,900 | — |
| Total Memory Bits | 5,760,000 | — |
| User I/O Count | 488 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Operating Frequency | Up to 600 MHz | — |
| Packhaging | 780-BBGA, FC-FBGA | 780-Ball FC-FBGA (Flip-Chip BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: current RoHS status] | Compliant |
| Number of Pins / Terminals | 780 | — |
| Form of Terminal | Ball | — |
| Package Code | BGA | — |
| Operating Temperature Grade | Commercial (C2) | Commercial (0C to +85C) |
| Logic Elements | — | 80,000 |
| Embedded Memory Bits | — | 6,843,392 bits |
| User I/Os | — | 488 |
| Logic Array Blocks (LABs) | — | 3,200 |
| DSP Blocks | — | 320 |
| Maximum Core Clock | — | 600 MHz |
| Configuration Mode | — | Active serial (AS), Passive serial (PS), JTAG, Fast passive parallel (FPP) |
| Lead-Free | — | Yes |
| Number of PLLs | — | 12 |
| I/O Standards Supported | — | LVDS, LVPECL, HSTL, SSTL, LVTTL, LVCMOS, PCI, PCI-X |