EP3SE50F780C4N vs EP3SE50F780C4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C4N sa pamamagitan ng Intel at EP3SE50F780C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE50F780C4G - Stratix III E FPGA, 47.5K LE, 488 I/O, 780-FBGA | Intel
EP3SE50F780C4G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3SE50F780C4N | EP3SE50F780C4G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Embedded Memory Bits | 5,760,000 | — |
| Embedded Memory (M9K/M144K blocks) | 488 (per family datasheet) | — |
| Number of LABs | 1900 | — |
| Maximum User I/Os | 488 | — |
| DSP Blocks (18x18 multipliers) | 432 | — |
| PLLs | 12 (per family datasheet) | — |
| Maximum Operating Frequency | 717 MHz | — |
| Transceiver Channels | Up to 12 (per family, model-dependent) | — |
| Transceiver Data Rate | Up to 6.375 Gbps (per Stratix III E family) | — |
| Process Node | 40 nm | — |
| Packhaging | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch | 780-ball FBGA (FCBGA) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (SMD/SMT) |
| Volte ng Pagbibigay | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) | — |
| Temperature na Operasyon | 0C to +85C (C4 commercial grade) | — |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| Tindminan RoHS | Lead-free / RoHS compliant | Compliant |
| Level ng MSL | 3 (per JEDEC J-STD-020, FBGA package) | MSL3 (per JEDEC J-STD-020) |
| Hard Memory Controller | DDR2/DDR3 SDRAM (per Stratix III E family) | — |
| Series | — | Stratix III |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Embedded Memory | — | 5.76 Mbit (5760000 bit) |
| Number of I/Os | — | 488 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count from datasheet] |
| Number of Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Process Technology | — | 40 nm TSMC |
| Core Supply Voltage | — | 1.1 V |
| Hanay ng Temperature na Operasyon | — | 0 C to +85 C (commercial) |
| Lead-Free | — | Yes |
| Configuration Memory | — | SRAM-based (volatile, requires configuration device) |
| Design Software | — | Quartus II |