EP3SE80F1152C4 vs EP3SE80F1152I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152C4 sa pamamagitan ng Intel at EP3SE80F1152I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE80F1152C4 - Stratix III E FPGA 80K LE 1152-FBGA | Intel / Altera
EP3SE80F1152C4 ✓ NakahandaIntel
EP3SE80F1152I3N - Stratix III E FPGA 80K LE, 1152-FCBGA | Intel
EP3SE80F1152I3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE80F1152C4 | EP3SE80F1152I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Series | Stratix III E | — |
| Family | Stratix III Enhanced | Stratix III E |
| Device Type | FPGA | — |
| Logic Elements | 80,000 | 80,000 |
| Logic Array Blocks (LABs) | 3200 | 3,200 |
| Total RAM Bits | 6,843,392 | — |
| User I/Os | 744 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm CMOS | 65 nm |
| Internal Frequency (max) | 800 MHz | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | -40 °C to +100 °C (Industrial) |
| Packhaging | 1152-ball FC-FBGA (Fine-pitch Chip-scale BGA) | 1152-ball FCBGA (Flip-Chip BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, JTAG / EPCS serial | — |
| DSP Blocks | Yes (variable-precision, 18x18 multipliers) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Embedded Memory Bits | — | 6,843,392 |
| Maximum User I/O | — | 744 |
| Auxiliary Supply Voltages | — | 1.2 V, 3.3 V |
| Maximum Internal Clock Frequency | — | 500 MHz |
| Speed Grade | — | I3 |
| Configuration Mode | — | JTAG / Passive Serial / Fast Passive Parallel |
| Configuration Encryption | — | AES-128 bitstream encryption supported |