EP3SE80F1152I3 vs EP3SE80F1152I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152I3 sa pamamagitan ng Intel at EP3SE80F1152I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE80F1152I4N - 80K LE Stratix III E FPGA, 1152-FCBGA | Intel
EP3SE80F1152I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE80F1152I3 | EP3SE80F1152I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Series | Stratix III E | Stratix III E |
| Device Family | Stratix III E | — |
| Logic Elements | 80,000 | 80,000 |
| LABs / CLBs | 3,200 | — |
| Total RAM Bits | 6,843,392 | — |
| Number of I/O | 744 | — |
| Bilang ng Pins | 1,152 | — |
| Package Type | 1152-BBGA, FCBGA | — |
| Package Dimensions | 35 mm x 35 mm | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Supply Voltage | 1.0 V | — |
| Temperature na Operasyon | 0C to 85C (Industrial) | — |
| Speed Grade | I3 | I4 |
| Internal Frequency | 500 MHz | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL Level] | 3 (per JEDEC J-STD-020) |
| Embedded Memory Bits | — | 6,843,392 bits |
| User I/O Count | — | 744 |
| Packhaging | — | 1152-BBGA, FCBGA (flip-chip) |
| Core Voltage | — | 1.1 V |
| Maximum Internal Frequency | — | 450 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C junction) |
| Uri ng Memory | — | SRAM-based configuration |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel (IEEE 1149.1 BST) |
| I/O Standards Supported | — | LVDS, LVCMOS, SSTL, HSTL, PCI, PCI-X |