EP3SE80F1152I3 vs EP3SE80F1152I4N 比較
詳細並排比較 EP3SE80F1152I3 由 Intel 與 EP3SE80F1152I4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE80F1152I3 | EP3SE80F1152I4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | 最後購買 |
| Series | Stratix III E | Stratix III E |
| Device Family | Stratix III E | — |
| Logic Elements | 80,000 | 80,000 |
| LABs / CLBs | 3,200 | — |
| Total RAM Bits | 6,843,392 | — |
| Number of I/O | 744 | — |
| 腳位數 | 1,152 | — |
| Package Type | 1152-BBGA, FCBGA | — |
| Package Dimensions | 35 mm x 35 mm | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Supply Voltage | 1.0 V | — |
| 工作溫度 | 0C to 85C (Industrial) | — |
| Speed Grade | I3 | I4 |
| Internal Frequency | 500 MHz | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| RoHS 狀態 | Compliant | Compliant |
| MSL 等級 | [DATA_NEEDED: MSL Level] | 3 (per JEDEC J-STD-020) |
| Embedded Memory Bits | — | 6,843,392 bits |
| User I/O Count | — | 744 |
| 封裝 | — | 1152-BBGA, FCBGA (flip-chip) |
| Core Voltage | — | 1.1 V |
| Maximum Internal Frequency | — | 450 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C junction) |
| 記憶體類型 | — | SRAM-based configuration |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel (IEEE 1149.1 BST) |
| I/O Standards Supported | — | LVDS, LVCMOS, SSTL, HSTL, PCI, PCI-X |