EP3SE80F780C2N vs EP3SE110F780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F780C2N sa pamamagitan ng Intel at EP3SE110F780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE80F780C2N | EP3SE110F780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | 4,300 |
| Embedded Memory | 6,843,392 bits | TriMatrix (MLAB + M9K + M144K) |
| User I/Os | 488 | 488 |
| Process Technology | 65 nm | 65 nm |
| Core Voltage (VCCINT) | 1.1 V | — |
| Auxiliary Voltage (VCCAUX) | 0.9 V | — |
| Packhaging | 780-Ball FC-FBGA | 780-ball FCBGA (Flip-Chip BGA) |
| Package Code | F780 | — |
| Speed Grade | C2 | — |
| Maximum Operating Frequency | 600 MHz | 500 MHz |
| Operating Temperature Grade | Commercial (0C to +85C) | Commercial (C suffix) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| Core Voltage | — | 1.1 V |
| DSP Blocks | — | Yes (integrated, count varies by configuration) |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |