EP3SL200H780I3 vs EP3SL200H780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I3 sa pamamagitan ng Intel at EP3SL200H780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780I3 | EP3SL200H780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | 12 (Stratix III PLL array) |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Packhaging | 780-BBGA, FCBGA (HBGA-780) | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | Yes |
| Process Node | — | 40 nm |
| Embedded Memory Bits | — | 10,901,504 bits |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Maximum Internal Clock Frequency | — | 800 MHz |
| Transceivers | — | 24 channels, up to 3.75 Gbps |
| DSP Blocks | — | 384 |
| Speed Grade | — | C3 (commercial, -3 speed) |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| Level ng MSL | — | 3 |
| Mounting Pitch | — | 1.0 mm ball pitch |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |