EP3SL200H780I3 vs EP3SL200H780C3N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP3SL200H780I3 tarafından Intel ve EP3SL200H780C3N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP3SL200H780I3 | EP3SL200H780C3N |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | 12 (Stratix III PLL array) |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| İşletim Sıcaklığı | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Paket | 780-BBGA, FCBGA (HBGA-780) | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Montaj Türü | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | Yes |
| Process Node | — | 40 nm |
| Embedded Memory Bits | — | 10,901,504 bits |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Maximum Internal Clock Frequency | — | 800 MHz |
| Transceivers | — | 24 channels, up to 3.75 Gbps |
| DSP Blocks | — | 384 |
| Speed Grade | — | C3 (commercial, -3 speed) |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| MSL Seviyesi | — | 3 |
| Mounting Pitch | — | 1.0 mm ball pitch |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |