EP3SL200H780I3 vs EP3SL200H780I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I3 sa pamamagitan ng Intel at EP3SL200H780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780I3 | EP3SL200H780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | Stratix III |
| Logic Elements | 200,000 | — |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | 488 |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Packhaging | 780-BBGA, FCBGA (HBGA-780) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| Logic Elements (LE) | — | 200,000 |
| Logic Array Blocks (LABs) | — | 8000 |
| Embedded Memory Bits | — | 10,901,504 |
| DSP Multipliers (18x18) | — | 384 |
| Voltage - Core Supply | — | 1.1 V |
| Package Type | — | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Speed Grade | — | I4 (industrial) |
| Temperature ng Junction na Operasyon | — | -40C to +100C (industrial) |
| Configuration Memory | — | SRAM-based, volatile |
| Tindminan RoHS | — | Compliant |
| Design Tool | — | Quartus II (legacy) / Quartus Prime |