EP3SL50F484I3N vs EP3SL50F484I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F484I3N sa pamamagitan ng Intel at EP3SL50F484I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL50F484I3N | EP3SL50F484I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix III L | Stratix III L (Low Power) |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Embedded Memory | 2,184,192 bits (2.1 Mbit) | — |
| Embedded 18x18 Multipliers | 218 | — |
| Maximum User I/O | 296 | 296 |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 0.9 V / 1.1 V | 1.1 V |
| Maximum Core Frequency | 500 MHz | — |
| Packhaging | 484-ball FBGA (FC-FBGA, 23x23 mm, 1.0 mm pitch) | 484-ball FC-FBGA (Flip-Chip FineLine BGA) |
| Temperature ng Junction na Operasyon | -40C to +100C (Industrial) | — |
| Uri ng Pagpapasok | Surface Mount (SMT) | Surface Mount |
| Lead-Free / RoHS | Lead Free / Compliant | [DATA_NEEDED: lead-free/RoHS status] |
| Level ng MSL | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | [DATA_NEEDED: MSL level] |
| Programming Tool | Quartus II (legacy) | — |
| Device Logic Elements | — | 47,500 |
| Embedded Memory (bits) | — | 2,184,192 |
| Internal Operating Frequency | — | 500 MHz |
| Temperature na Operasyon | — | 0 °C to +85 °C (commercial) |
| Configuration Scheme | — | SRAM-based (volatile, requires external config device) |
| Transceivers | — | Stratix III L — supports high-speed serial transceivers per family datasheet |