EP3SL70F484I3 vs EP3SL70F484I3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F484I3 sa pamamagitan ng Intel at EP3SL70F484I3G sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL70F484I3 EP3SL70F484I3G
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family Stratix III L Stratix III (low-power variant)
Logic Elements 67,500 —
Adaptive Logic Modules (ALMs) 33,000 —
Logic Array Blocks (LABs) 2,700 —
Total Embedded Memory 2,699,264 bits (337 KB) —
M9K Memory Blocks 288 —
M144K Memory Blocks 12 —
DSP Blocks (18x18 multipliers) 384 —
User I/O Pins 296 296
Transceivers Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] 24
PLLs 8 (4 enhanced PLLs + 4 fast PLLs) —
Process Node TSMC 40 nm —
Speed Grade -3 (mid-tier) I3
Temperature na Operasyon -40C to +100C (industrial) —
Packhaging 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch —
Configuration Modes FPP, AS, PS, JTAG, AES encryption —
Design Software Quartus II (legacy) —
Tindminan RoHS Compliant Compliant
Series — Stratix III L
Logic Elements (LE) — 67,500
ALMs (Adaptive Logic Modules) — [DATA_NEEDED: ALM count]
Total Memory Bits — 2,699,264
DSP Blocks — [DATA_NEEDED: DSP block count]
Maximum Transceiver Data Rate — [DATA_NEEDED: max transceiver Gbps]
Package Type — 484-ball FCBGA (Fine-pitch Chip-Scale BGA)
Package Pin Count — 484
Hanay ng Temperature na Operasyon — -40C to +100C (Industrial)
Core Voltage — 1.0 V
Process Technology — 40 nm TSMC
Uri ng Pagpapasok — Surface Mount
Level ng MSL — [DATA_NEEDED: MSL level]
Configuration Interface — JTAG / Serial Passive / Active Serial

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