EP3SL70F780C3 vs EP3SL70F780C4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780C3 sa pamamagitan ng Intel at EP3SL70F780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL70F780C3 EP3SL70F780C4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Series Stratix III L Stratix III L
Family Stratix III —
Logic Elements (LE) 67,500 67,500
Embedded Memory (bits) 2,699,264 —
Logic Array Blocks (LABs) 2,700 2,700
User I/O Count 488 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Number of Pins / Balls 780 —
Packhaging 780-BBGA, FC-FBGA —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Process Technology 65 nm 65 nm
Core Voltage (VCCINT) 1.1 V —
Maximum Internal Clock Frequency 500 MHz —
Hanay ng Temperature na Operasyon 0°C to 85°C (commercial) —
Speed Grade C3 C4
Design Software Quartus II (last supported v13.1) Quartus II (Stratix III device support)
Tindminan RoHS [DATA_NEEDED: RoHS status] —
Manufacturer — Intel (formerly Altera)
Device Type — FPGA - Field Programmable Gate Array
Total Memory Bits — 2,699,264 bits (~2.7 Mb)
Maximum User I/O — 488
Internal Frequency (max) — [DATA_NEEDED: internal frequency]
Core Voltage (VCC) — 0.9 V
Temperature na Operasyon — 0C to 85C (commercial)
Package Type — 780-BBGA, FC-FBGA (Flip-Chip)
Lead Free / RoHS — Yes (lead-free per BGA package)
Configuration Method — JTAG, Passive Serial, FPP, external memory

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