EP4CE6E22C6 vs EP4CE6E22I7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE6E22C6 sa pamamagitan ng Intel at EP4CE6E22I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CE6E22C6 EP4CE6E22I7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone IV E Cyclone IV E
Device Logic Elements 6,272 LE —
Logic Array Blocks (LABs) 392 LABs —
Total RAM Bits 270 Kbit —
Embedded 18x18 Multipliers 15 —
PLLs 2 —
Maximum User I/Os 91 —
Core Voltage 1.2 V —
Speed Grade C6 —
Temperature na Operasyon 0 °C to +85 °C (Commercial) —
Package Type 144-pin EQFP (Enhanced QFP, exposed pad) —
Package Dimensions 22 mm × 22 mm —
Lead Pitch 0.5 mm —
Uri ng Pagpapasok Surface Mount Surface Mount
Process Technology TSMC 60 nm low-k 60 nm (TSMC low-power)
Configuration Method SRAM-based (volatile); JTAG, Active Serial, Passive Serial Serial (EPCS) or JTAG
Tindminan RoHS Compliant Compliant
Logic Elements (LEs) — 6,272
Configurable Logic Blocks (CLBs) — 392
Embedded Memory (RAM) — 270 Kbits
User Flash Memory — 4 Kbits
User I/O Pins — 91
PLLs (General-Purpose) — 2
Global Clock Networks — Up to 20
Core Voltage (VCCINT) — 1.0 V to 1.2 V (nominal 1.2 V)
Operating Temperature (I7 grade) — -40C to +100C (junction)
Maximum Operating Frequency — Up to 472.5 MHz
Packhaging — 144-pin EQFP (Plastic Enhanced QFP) with exposed pad
Supported I/O Standards — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Level ng MSL — 3 (per JEDEC J-STD-020)

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