EP4CGX110DF27I7N vs EP4CGX110DF31I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF27I7N sa pamamagitan ng Intel at EP4CGX110DF31I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX110DF27I7N - Cyclone IV GX FPGA, 110K LEs, 672-FBGA | Intel
EP4CGX110DF27I7N ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP4CGX110DF27I7N | EP4CGX110DF31I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV GX | Cyclone IV GX |
| Device Family | EP4CGX110 | — |
| Logic Elements (LEs) | 109,424 | — |
| Logic Array Blocks (LABs) | 6,422 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| Memory Blocks (M9K) | 610 | — |
| Embedded 18x18 Multipliers | 280 | — |
| User I/Os | 393 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 8 (up to 3.125 Gbps) |
| PCIe Hard IP Blocks | 4 (Gen1 x1/x2/x4) | — |
| PLLs | 4 | 4 |
| Core Voltage | 1.2 V | 1.2 V typical |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Packhaging | 672-ball FBGA, 1.0 mm pitch | 896-BGA (FBGA-896), 31 mm |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Process Node | 60 nm | — |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Device Logic Elements | — | 109,424 |
| Total Memory Bits | — | 5,621,760 |
| Number of Logic Array Blocks (LABs) | — | Not specified in provided data [DATA_NEEDED: LAB count] |
| Number of I/O | — | 475 user I/O |
| Multipliers (18x18) | — | 432 |
| M9K Memory Blocks | — | 270 |
| Ball Pitch | — | 0.8 mm |
| Speed Grade | — | -7 |
| Temperature Grade | — | Industrial (-40C to +100C Tj) |
| Configuration Method | — | SRAM (EPCS or JTAG) |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] |