EP4CGX110DF31C7N vs EP4CGX110DF31I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF31C7N sa pamamagitan ng Intel at EP4CGX110DF31I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX110DF31C7N | EP4CGX110DF31I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | — |
| Logic Elements | 109,424 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| Maximum User I/O | 475 | — |
| Process Technology | 60 nm | — |
| Core Voltage (VCCINT) | 1.2 V nominal (1.16 V to 1.24 V) | — |
| PLL Analog Voltage (VCCA) | 2.5 V nominal (2.375 V to 2.625 V) | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 8 (up to 3.125 Gbps) |
| Hard IP Block | PCIe Gen1 x1/x2/x4 | — |
| PLLs | 4 general-purpose | 4 |
| Packhaging | 896-ball FBGA (F31) | 896-BGA (FBGA-896), 31 mm |
| Speed Grade | C7 (commercial) | -7 |
| Operating Temperature (Commercial) | 0 °C to 85 °C (TJ) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Cyclone IV GX |
| Device Logic Elements | — | 109,424 |
| Total Memory Bits | — | 5,621,760 |
| Number of Logic Array Blocks (LABs) | — | Not specified in provided data [DATA_NEEDED: LAB count] |
| Number of I/O | — | 475 user I/O |
| Multipliers (18x18) | — | 432 |
| M9K Memory Blocks | — | 270 |
| Ball Pitch | — | 0.8 mm |
| Temperature Grade | — | Industrial (-40C to +100C Tj) |
| Core Voltage | — | 1.2 V typical |
| Configuration Method | — | SRAM (EPCS or JTAG) |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] |