EP4CGX50DF27C7N vs EP4CGX50DF27I7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF27C7N sa pamamagitan ng Intel at EP4CGX50DF27I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP4CGX50DF27C7N EP4CGX50DF27C7N - Cyclone IV GX FPGA 49,888 LEs | Intel

EP4CGX50DF27C7N - Cyclone IV GX FPGA 49,888 LEs | Intel

EP4CGX50DF27C7N ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro EP4CGX50DF27C7N EP4CGX50DF27I7
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone IV GX Cyclone IV GX
Logic Elements (LE) 49,888 —
Logic Array Blocks (LAB) [DATA_NEEDED: LAB count for EP4CGX50] —
Total Embedded Memory Bits 2,562,048 —
User I/O Pins (max) 310 —
Transceivers Yes (3.125 Gbps GX channels, package-dependent) —
Core Supply Voltage 1.2 V 1.2 V
Process Node 60 nm —
Operating Temperature (Commercial 'C') 0C to +85C —
Packhaging 672-pin FBGA (FineLine BGA) 672-ball FBGA (F27, 27x27 mm, 1.0 mm pitch)
Uri ng Pagpapasok Surface Mount Surface Mount
PLL Count 6 —
Hard Memory Controller DDR/DDR2/DDR3/QDRII/RLDRAM PHY —
Tindminan RoHS Compliant Compliant
Lead-Free Yes —
Logic Elements — 49,888 LE
Embedded Memory — 2,562,048 bits (2.44 Mbit) / 250 M9K blocks of 9 Kbit
Number of LABs/CLBs — 3,118
Embedded 18x18 Multipliers — 56
User I/Os — 310
Number of Transceivers — 8 (up to 3.125 Gbps)
PCIe Hard IP — 1 Gen1 controller (x1/x2/x4)
Process Technology — 60 nm
Temperature na Operasyon — -40 C to +100 C (industrial I7 grade)
Configuration Method — SRAM-based, JTAG/AS/PS

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