EP4SGX290NF45I4N vs EP4SGX360FF35C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX290NF45I4N sa pamamagitan ng Intel at EP4SGX360FF35C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX290NF45I4N | EP4SGX360FF35C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 291,200 | 353600 |
| LABs/CLBs | 11,648 | — |
| Total RAM Bits | 17,661,952 | 23105536 |
| User I/O Count | 920 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 0.87 V to 0.93 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Transceivers | 8.5 Gbps multi-gigabit (GX) | — |
| Packhaging | 1932-BBGA, FCBGA (NF45) | 1152-BBGA, FCBGA (flip-chip) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature ng Junction na Operasyon | -40C to +100C (industrial) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: rohs status] |
| JESD-609 Code | e1 | — |
| Package Body Material | Plastic / Epoxy | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Number of LABs/CLBs | — | 14144 |
| Number of I/O | — | 564 |
| Number of Transceivers | — | 8 |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-Free | — | Yes (per BGA finish) |
| Supplier Device Package | — | 1152-FBGA |