EP4SGX290NF45I4N vs EP4SGX360FF35C4 比較
詳細並排比較 EP4SGX290NF45I4N 由 Intel 與 EP4SGX360FF35C4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4SGX290NF45I4N | EP4SGX360FF35C4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | Obsolete |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 291,200 | 353600 |
| LABs/CLBs | 11,648 | — |
| Total RAM Bits | 17,661,952 | 23105536 |
| User I/O Count | 920 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 0.87 V to 0.93 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Transceivers | 8.5 Gbps multi-gigabit (GX) | — |
| 封裝 | 1932-BBGA, FCBGA (NF45) | 1152-BBGA, FCBGA (flip-chip) |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作接面溫度 | -40C to +100C (industrial) | — |
| RoHS 狀態 | Compliant | [DATA_NEEDED: rohs status] |
| JESD-609 Code | e1 | — |
| Package Body Material | Plastic / Epoxy | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Number of LABs/CLBs | — | 14144 |
| Number of I/O | — | 564 |
| Number of Transceivers | — | 8 |
| 工作溫度 | — | 0C to +85C (commercial) |
| MSL 等級 | — | 3 (per JEDEC J-STD-020) |
| Lead-Free | — | Yes (per BGA finish) |
| Supplier Device Package | — | 1152-FBGA |