EP4SGX360FH29C4 vs EP4SGX360FH29C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FH29C4 sa pamamagitan ng Intel at EP4SGX360FH29C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX360FH29C4 | EP4SGX360FH29C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Stratix IV GX | — |
| Family | Stratix IV | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | 141,440 | 14144 LABs |
| Logic Array Blocks (LABs) | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| User I/Os | 289 | — |
| Transceivers | [DATA_NEEDED: number of transceivers and max data rate] | Multi-gigabit serial transceivers (per device variant) |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 40 nm | — |
| Temperature na Operasyon | 0 C to +85 C (commercial, C4 grade) | Commercial (0C to +85C) |
| Packhaging | 780-ball FC-HFBGA (HBGA-780), 33 x 33 mm | 780-FCBGA (HBGA-780), 33 x 33 mm |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | — |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free and halogen-free status] | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Configuration Method | JTAG / Fast Passive Parallel / Active Serial | — |
| Maximum User I/Os | — | 289 |
| Process Technology | — | 40 nm CMOS |
| Embedded Memory | — | 22.4 Mbits (M9K + M144K blocks) |
| Embedded 18x18 Multipliers | — | Up to 1,040 |
| Memory Standards Supported | — | DDR/DDR2/DDR3 SDRAM, QDRII/RLDRAM II |
| Hard IP Blocks | — | PCIe Gen1/Gen2, CPRI, OBSAI, Serial RapidIO |
| Speed Grade | — | C3 |