EP4SGX360HF35C2 vs EP4SGX360HF35I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360HF35C2 sa pamamagitan ng Intel at EP4SGX360HF35I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX360HF35C2 - Stratix IV GX FPGA, 353K LEs, 35x35mm FCBGA | Intel
EP4SGX360HF35C2 ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP4SGX360HF35C2 | EP4SGX360HF35I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX FPGA | Stratix IV GX Field Programmable Gate Array |
| Logic Elements (LEs) | 353,600 | 353,600 |
| LABs/CLBs | 14,144 | — |
| Number of I/O | 564 (max 532 user I/O) | — |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 |
| Number of Logic Cells | 353,600 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Transceivers | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) | — |
| Package Type | 1152-pin FC-FBGA | 1152-Ball FCBGA (FineLine BGA) |
| Package Code | HF35 (35x35 mm, 1.0 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Temperature na Operasyon | 0C to +85C (commercial) | -40 °C to +100 °C (Industrial) |
| Tindminan RoHS | Compliant | Compliant |
| Configuration | JTAG / Active Serial (external config device) | — |
| Design Tool | Quartus II / Quartus Prime | — |
| Manufacturer | — | Intel (formerly Altera) |
| Total LABs | — | 14,144 |
| User I/Os | — | 564 |
| Speed Grade | — | F35 |
| I/O Standards Supported | — | LVDS, LVTTL, LVPECL, HSTL, SSTL |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| DSP Blocks | — | Yes (hard DSP blocks) |
| Configuration Modes | — | Serial, Parallel, JTAG, Active Serial |