EPF10K100EBC356-2 vs EPF10K100EBC356-1X Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EBC356-2 sa pamamagitan ng Intel at EPF10K100EBC356-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K100EBC356-2 EPF10K100EBC356-1X
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Series FLEX-10KE FLEX 10KE
Family Embedded Programmable Logic Device (PLD) —
Typical Gates 100,000 100,000
Maximum System Gates 158,000 —
Logic Elements (LEs) 4,992 —
Number of LABs/CLBs 624 —
Embedded Array Blocks (EABs) 12 12
Total RAM Bits 49,152 49,152
User I/O Pins 274 —
Supply Voltage (Core) 2.375 V to 2.625 V (2.5 V nominal) —
Propagation Delay (tPD) 0.5 ns —
Internal Operating Frequency up to 250 MHz —
Process Technology CMOS, SRAM-based —
Package Type 356-LBGA (35 x 35 mm, 1.27 mm pitch) 356-LBGA (BGA-356)
Temperature na Operasyon 0 C to 70 C (Commercial) 0 C to +70 C (Commercial)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Configuration Method SRAM, JTAG (IEEE 1149.1) Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1)
Speed Grade -2 -1X
Tindminan RoHS [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: lead-free status] —
Logic Elements — 4,992
Logic Array Blocks (LABs) — 624
User I/O Count — 274
Propagation Delay — 0.6 ns
Logic Family — CMOS
Core Process Technology — 0.22 um CMOS, 5 metal layers
Core Supply Voltage — 2.5 V (2.375 V to 2.625 V)
I/O Supply Voltage — 3.3 V (multi-volt tolerant to 5 V)
Package Dimensions — 35 x 35 mm, 1.27 mm ball pitch
Level ng MSL — [DATA_NEEDED: MSL rating]

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