EPF10K100EFC484-3N vs EPF10K130EFC484-3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EFC484-3N sa pamamagitan ng Intel at EPF10K130EFC484-3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K100EFC484-3N EPF10K130EFC484-3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family FLEX 10KE —
Logic Elements / Cells 4992 —
Total Gates 100,000 —
Embedded Memory (EAB) 49,152 bits (12 EABs) —
Logic Array Blocks (LABs) 624 —
User I/Os 338 —
Process Technology 0.22 µm CMOS 0.22 µm CMOS
Core Voltage (VCCINT) 2.5 V —
I/O Voltage (VCCIO) MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) —
Internal Performance 200 MHz —
Speed Grade -3 (fastest commercial bin) -3 (faster timing bin)
Packhaging 484-ball FineLine BGA (FC484 / FBGA-484) —
Temperature Grade Commercial (0 °C to +70 °C) —
Configuration Method SRAM (external EPROM/Flash/JTAG required at power-up) —
Lead-Free / RoHS Yes (N suffix = lead-free) —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Series — FLEX-10KE
Number of Logic Elements / Cells — 6656
Total RAM Bits — 65536
Typical Gate Count — 130000
Number of I/O — 369
Number of LABs/CLBs — 832
Number of Embedded Array Blocks (EABs) — 72
Operating Temperature Grade — Commercial (0C to +70C)
Core Voltage — 2.5 V
Package Type — 484-BBGA (FineLine BGA)
Package Dimensions — 23 x 23 mm
Ball Pitch — 1.0 mm
Configuration Memory — SRAM-based (volatile, requires config device)
Tindminan RoHS — [DATA_NEEDED: RoHS status]
Configuration Interface — JTAG / PS / PPS / Altera serial

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