EPF10K200EBC600-3 vs EPF10K200EBC600-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBC600-3 sa pamamagitan ng Intel at EPF10K200EBC600-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 Obsolete
Pagsanggunian na paghahambing
| Parametro | EPF10K200EBC600-3 | EPF10K200EBC600-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE | — |
| Series | FLEX-10KE | FLEX-10KE |
| System Gates | 200,000 | — |
| Logic Elements / Cells | 9,984 | — |
| Logic Array Blocks (LABs) | 1248 | 1248 |
| Embedded Memory (EABs) | 24,576 bits | — |
| Maximum User I/O | 470 | 470 pins |
| Number of PLLs | 4 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Process Technology | 0.22 micrometer SRAM | 0.30 µm CMOS |
| Speed Grade | -3 (commercial) | — |
| Packhaging | 600-ball FineLine BGA, 45 x 45 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0C to +70C (commercial) | 0°C to +70°C (Commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | unknown |
| Logic Family | — | CMOS (SRAM-based) |
| Typical Gate Count | — | 200,000 gates |
| Logic Elements (LEs) | — | 9984 |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Propagation Delay | — | 0.4 ns |
| Volte ng Pagbibigay | — | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Package Dimensions | — | 45 × 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| Configuration Method | — | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Part Status | — | Obsolete |