EPF10K250EBC600-3 vs EPF10K250EFC672-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EBC600-3 sa pamamagitan ng Intel at EPF10K250EFC672-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K250EBC600-3 EPF10K250EFC672-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE FLEX 10KE
Logic Elements 12,160 LEs —
Typical Gates 250,000 —
Maximum User I/O 470 —
Embedded Array Blocks (EABs) 12 (each 2 Kbits) —
Total Embedded Memory 24 Kbits (RAM) —
PLLs (Phase-Locked Loops) 4 —
Dedicated Clock Inputs 6 —
Speed Grade -3 -3 (fastest)
Core Supply Voltage 3.3 V 2.5 V
I/O Supply Voltage 3.3 V (5 V tolerant) MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V
Packhaging 600-ball FineLine BGA 672-ball FineLine BGA (FC)
Configuration Mode Passive Serial / Passive Parallel / JTAG JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM
Boundary Scan IEEE 1149.1 (JTAG) —
Temperature na Operasyon [DATA_NEEDED: operating temperature range] —
Process Technology SRAM-based CMOS 0.25 um CMOS, 5-layer metal
Product Type — FPGA (Field Programmable Gate Array)
Maximum Typical Gates — 250,000
Logic Elements (LEs) — 12,160
Embedded Memory (EAB) — 655,360 bits (80 EABs x 2,048 bits each)
Logic Array Blocks (LABs) — 392 (8 LEs per LAB)
User I/O Pins — 470
Temperature Grade — Commercial (0C to +70C)
Ball Pitch — 1.0 mm
Uri ng Pagpapasok — Surface Mount
Tindminan RoHS — [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing]
Lead-Free — [DATA_NEEDED: lead-free status]

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