EPM2210GF324C4N vs EPM2210GF324C5 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM2210GF324C4N sa pamamagitan ng Intel at EPM2210GF324C5 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
EPM2210GF324C5 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPM2210GF324C4N | EPM2210GF324C5 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Family | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1,700 |
| User I/Os (max) | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Logic Delay (tPD) | 7.0 ns (C4 speed grade) | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 6-layer-metal flash, 0.18 um |
| Packhaging | 324-ball FineLine BGA (GF324) | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | — |
| Operating Temperature (commercial) | 0 °C to +85 °C | — |
| Tindminan RoHS | Compliant | Compliant (lead-free) |
| Device Name | — | EPM2210 |
| Logic Elements (LE) | — | 2,210 |
| Maximum User I/Os | — | 272 |
| Pin-to-Pin Delay (tPD1) | — | 5 ns (C5 speed grade) |
| Internal Performance | — | 304 MHz |
| Core Voltage (VCCINT) | — | 1.8 V |
| I/O Voltage (VCCIO) - MultiVolt | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Temperature ng Junction na Operasyon | — | 0C to +85C (commercial) |
| In-System Programmability | — | JTAG (IEEE 1149.1) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |