EPM2210GF324C4N vs EPM2210GF324C5 Comparison

Detailed side-by-side comparison of EPM2210GF324C4N by Intel and EPM2210GF324C5 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM2210GF324C4N EPM2210GF324C5
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Last Time Buy
Family MAX II MAX II
Device Type CPLD (Complex Programmable Logic Device) —
Logic Elements 2,210 —
Equivalent Macrocells 1,700 1,700
User I/Os (max) 272 —
User Flash Memory (UFM) 8 Kbits 8 Kbits
Supply Voltage - Core (VCCINT) 1.8 V —
MultiVolt I/O Support 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V —
Maximum Internal Frequency 247.5 MHz —
Pin-to-Pin Logic Delay (tPD) 7.0 ns (C4 speed grade) —
Process Technology 0.18 µm 6-layer-metal flash 6-layer-metal flash, 0.18 um
Package 324-ball FineLine BGA (GF324) 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm
Programming Interface IEEE 1149.1 JTAG (ISP) —
Operating Temperature (commercial) 0 °C to +85 °C —
RoHS Status Compliant Compliant (lead-free)
Device Name — EPM2210
Logic Elements (LE) — 2,210
Maximum User I/Os — 272
Pin-to-Pin Delay (tPD1) — 5 ns (C5 speed grade)
Internal Performance — 304 MHz
Core Voltage (VCCINT) — 1.8 V
I/O Voltage (VCCIO) - MultiVolt — 1.5 V / 1.8 V / 2.5 V / 3.3 V
Operating Junction Temperature — 0C to +85C (commercial)
In-System Programmability — JTAG (IEEE 1149.1)
Mounting Type — Surface Mount (BGA)

Datasheets & Resources

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