EPM570F256C5 vs EPM570F256C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM570F256C5 sa pamamagitan ng Intel at EPM570F256C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPM570F256C5 - MAX II CPLD, 570 LE, 256-BGA, 201 MHz | Intel / Altera
EPM570F256C5 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EPM570F256C5 | EPM570F256C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX II | — |
| Logic Elements | 570 | — |
| Macro Cells | 440 | — |
| User I/O | 160 | — |
| User Flash Memory | 8 Kbit | — |
| Process Technology | 0.18 µm | 0.18 um, 6-layer-metal flash CMOS |
| Supply Voltage - Internal | 2.5 V / 3.3 V | — |
| Maximum Operating Frequency | 201.1 MHz | 304 MHz |
| Propagation Delay (tPD max) | 5.4 ns | — |
| Programmable Type | In System Programmable (Flash) | — |
| JTAG Support | IEEE 1149.1 | — |
| Packhaging | 256-ball FBGA | 256-ball FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0 °C to +85 °C (Commercial) | — |
| Speed Grade | C5 (5 ns) | — |
| Family | — | MAX II |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Programming Interface | — | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Level ng MSL | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Tindminan RoHS | — | Compliant (per DigiKey listing) |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |