EPM570GF256C5N vs EPM570ZF256C7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPM570GF256C5N sa pamamagitan ng Intel at EPM570ZF256C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPM570GF256C5N EPM570ZF256C7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family MAX II —
Logic Elements 570 —
Macrocells 440 —
Maximum User I/Os 212 —
Pin-to-Pin Delay (tPD) 5.4 ns —
Maximum Frequency (fMAX) 304 MHz —
User Flash Memory (UFM) 8 Kbits —
Operating Voltage (VCCINT) 3.3 V —
I/O Voltage Support (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V —
Packhaging 256-ball FineLine BGA (17 x 17 mm, 1.0 mm pitch) —
Process Technology 0.18 µm Flash-based CMOS 0.18 µm flash-based CMOS
Configuration Method Non-volatile, instant-on (Flash) —
Programming Interface JTAG (IEEE 1149.1) / ISP JTAG (IEEE 1149.1)
Temperature na Operasyon -40 °C to +125 °C (Industrial) —
Lead-Free / RoHS Yes (Lead-free finish) —
Series — MAX II
Programmable Type — In System Programmable
Macro Cells — 440
Logic Elements (LE) — 440
Embedded Flash Memory — 8 Kbit
Pin-to-Pin Logic Delay (tPD) — 9 ns
Maximum Operating Frequency — 201 MHz (internal)
Maximum User I/O Pins — 160
Supply Voltage - Internal (VCCINT) — 1.71 V to 1.89 V
I/O Bank Voltages — 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Supplier Device Package — 256-MBGA (11x11 mm)
Package Type Code — 256-FBGA / 256-TFBGA
Ball Pitch — 1.0 mm
Hanay ng Temperature na Operasyon — 0 °C to +85 °C (commercial, suffix 'C')
Uri ng Pagpapasok — Surface Mount
Tindminan RoHS — Compliant
Lead-Free Status — Lead free

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