EPM570GT144C3N vs EPM570GT144C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM570GT144C3N sa pamamagitan ng Intel at EPM570GT144C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPM570GT144C3N | EPM570GT144C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | 570 |
| Equivalent Macrocells | 440 | 440 |
| User I/Os | 116 | — |
| Pin-to-Pin Logic Delay (tPD1) | 5.4 ns | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits (8,192 bits) |
| Internal Supply Voltage | 1.71 V to 1.89 V | — |
| I/O Standards Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS/LVTTL | — |
| Programmable Type | In System Programmable (Flash) | — |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG IEEE 1149.1 (ISP) |
| Packhaging | 144-pin TQFP (20 x 20 mm) | 144-pin TQFP (GT144) |
| Temperature na Operasyon | 0 C to +85 C (Commercial) | 0 °C to +85 °C (commercial, C3 grade) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Process Technology | 6-layer-metal flash CMOS | 0.30 µm 6-layer-metal flash CMOS |
| User I/O Count | — | 76 (max, package-dependent) |
| Pin-to-Pin Propagation Delay (tPD1) | — | 5.4 ns (commercial, fastest speed grade) |
| Core Supply Voltage | — | 1.8 V (internal regulator from VCCINT 3.3 V) |
| I/O Supply Voltages | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Configuration Method | — | Non-volatile on-chip flash (instant-on) |
| Level ng MSL | — | MSL 3 (per JEDEC J-STD-020) |