H5AN4G8NBJR-UHCR vs H5AN4G8NBJR-UHI Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng H5AN4G8NBJR-UHCR sa pamamagitan ng SK hynix at H5AN4G8NBJR-UHI sa pamamagitan ng SK hynix. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | H5AN4G8NBJR-UHCR | H5AN4G8NBJR-UHI |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | 4 Gbit |
| Organisasyon | 512M x 8 | 512M x 8 |
| Speed Grade | UH (DDR4-2400 class, PC2400) | DDR4-2400 (PC4-19200) |
| Volte ng Pagbibigay | 1.2 V (VDD) | — |
| Interface | DDR4 SSTL12 | JEDEC DDR4 SDRAM |
| Internal Prefetch | 8n | — |
| Packhaging | 78-ball FBGA (11 mm x 7.5 mm) | FBGA-78 (78-ball fine-pitch BGA) |
| Uri ng Pagpapasok | Surface Mount (BGA solder-down) | Surface Mount |
| Operating Case Temperature | -40C to +85C (industrial range) | — |
| Extended Temperature Range | Up to +95C case temperature (per datasheet conditions) | — |
| Lead Free | Yes | — |
| Wala sa Halogen | Yes | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging Suffix | -R = Tape and Reel | — |
| Refresh | [DATA_NEEDED: refresh rate 1x/2x specification] | Self-refresh and auto-refresh support |
| Latensya ng CAS | [DATA_NEEDED: CL value for UH grade] | [DATA_NEEDED: CAS latency at DDR4-2400] |
| Supply Voltage (VDD) | — | 1.2 V |
| Grade | — | Industrial (-UHI suffix) |
| Rate ng Data | — | 2400 MT/s |
| Bank Architecture | — | DDR4 bank group architecture |
| Termination | — | On-die termination (ODT) |
| Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |