H5TC4G63AFR-PBR vs H5TC4G63MFR-PBA Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng H5TC4G63AFR-PBR sa pamamagitan ng SK hynix at H5TC4G63MFR-PBA sa pamamagitan ng SK hynix. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | H5TC4G63AFR-PBR | H5TC4G63MFR-PBA |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Presyo ng Yunit (USD) | $5.91 | — |
| Uri ng Memory | DDR3L SDRAM | DDR3L SDRAM |
| Organisasyon | 256M x 16 | 256M x 16 |
| Total Capacity | 4Gb | — |
| Volte ng Pagbibigay | 1.35V (1.5V compatible) | — |
| Rate ng Data | 1600 Mbps (PC3L-12800) | 1866 Mbps (PC3L-14900) |
| Latensya ng CAS | 11 | — |
| tRCD/tRP | 11 | — |
| Clock Frequency | 800 MHz | — |
| tCK | 1.25 ns | — |
| tRCD | 13.125 ns | — |
| Burst Length | 8 (BL8) with burst chop (BC4) | BL8, BL4 (with burst chop) |
| Number of Banks | 8 | 8 |
| Refresh Interval | 7.8us at 85C, 3.9us at 95C | — |
| Packhaging | 96-ball FBGA (PBGA96) | 96-ball FBGA |
| Package Dimensions | 13.5mm x 9.0mm | — |
| Ball Pitch | 0.8mm | — |
| I/O Interface | SSTL-15 | — |
| Temperature na Operasyon | 0C to +95C | — |
| RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Wala sa Halogen | Yes | — |
| Density | — | 4 Gb |
| Supply Voltage (VDD/VDDQ) | — | 1.35V (+0.100V/-0.067V) |
| CAS Latency (CL) | — | Programmable |
| CAS Write Latency (CWL) | — | Programmable |
| Additive Latency | — | Programmable |
| On-Die Termination (ODT) | — | Yes |
| ZQ Calibration | — | Yes |
| Write Leveling | — | Yes |
| Auto Self-Refresh | — | Yes |
| Temperature-Compensated Self-Refresh | — | Yes |
| Process Technology | — | 30nm-class |
| RoHS Compliant | — | Yes (Lead-Free & Halogen-Free) |