K4A4G165WD-BCPB vs K4A4G165WF-BCWE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K4A4G165WD-BCPB sa pamamagitan ng Samsung Electronics at K4A4G165WF-BCWE sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | K4A4G165WD-BCPB | K4A4G165WF-BCWE |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Katayuan ng Stock | — | In Stock |
| Presyo ng Yunit (USD) | — | $10.65 |
| Uri ng Memory | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | — |
| Organisasyon | 256M x 16 | 256M x 16 |
| Rate ng Data | 2133 MT/s | 3200 Mbps |
| Core Voltage | 1.2 V | — |
| Packhaging | FBGA-96 | FBGA-96 (TFBGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Die Generation | D-die | Samsung F-die |
| Bank Architecture | 4 bank groups x 4 banks | — |
| Latensya ng CAS | [DATA_NEEDED: CAS Latency at 2133 speed bin] | — |
| Burst Length | 8 (BL8, fixed/chop) | — |
| Interface | DDR4 (synchronous, source-synchronous strobe) | Parallel |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | 0C to +85C |
| Pb-Free | Yes (per Samsung part-numbering suffix) | — |
| Tindminan RoHS | Compliant (lead-free suffix) | Compliant (per JLCPCB listing) |
| Refresh | Self-refresh supported (TCSR per DDR4 standard features) | — |
| Memory Density | — | 4 Gbit |
| Clock Frequency | — | 1.6 GHz |
| Volte ng Pagbibigay | — | 1.2 V (1.14 V to 1.26 V) |
| Access Time | — | 19 ns |
| Data Mask | — | Supported (DM) |
| ZQ Calibration | — | Supported |
| On-Die Termination | — | Dynamic ODT supported |
| CRC | — | Supported |
| Auto Precharge | — | Supported |
| Asynchronous Reset | — | Supported |