K4RBH046VM-BCWM vs K4RHE086VB-BCWM Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K4RBH046VM-BCWM sa pamamagitan ng Samsung Electronics at K4RHE086VB-BCWM sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Samsung Electronics
K4RBH046VM-BCWM - 32Gb DDR5 5600Mbps DRAM | Samsung | Server
K4RBH046VM-BCWM ✓ NakahandaPagsanggunian na paghahambing
| Parametro | K4RBH046VM-BCWM | K4RHE086VB-BCWM |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DDR5 SDRAM | DDR5 SDRAM |
| Laki ng Memory | 32 Gb | — |
| Memory Organization | 2G x 4 | — |
| Rate ng Data | 5600 Mbps | 5600 Mbps |
| Volte ng Pagbibigay | 1.1 V | 1.1 V |
| Memory Interface | Parallel | — |
| Technology | DRAM | — |
| Memory Format | Volatile | — |
| Temperature na Operasyon | 0 C to 85 C | [DATA_NEEDED: operating temperature range] |
| Packhaging | 78-ball FBGA | 82 FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Product Status | Sample | — |
| Manufacturer | Samsung Electronics | Samsung Semiconductor |
| Speed Grade | DDR5-5600 | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS Status] | unknown |
| Access Time / CL | [DATA_NEEDED: CAS Latency] | — |
| Density | — | 24 Gb |
| Organisasyon | — | 2G x 8 |
| Interface | — | DDR5 (JEDEC) |
| Configuration | — | x8 |
| Application Segment | — | Server / Data Center / Premium PC |
| Access Time / CAS Latency | — | [DATA_NEEDED: CAS latency] |
| On-Die ECC | — | [DATA_NEEDED: on-die ECC support] |
| Package Height | — | [DATA_NEEDED: package height] |