MC9S12DT256VPVE vs MC9S12DG256CCPV Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S12DT256VPVE sa pamamagitan ng NXP Semiconductors at MC9S12DG256CCPV sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256VPVE NrndNXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndPagsanggunian na paghahambing
| Parametro | MC9S12DT256VPVE | MC9S12DG256CCPV |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | NRND |
| Core | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) |
| Maximum Bus Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB | 256 KB (256K x 8) |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| Packhaging | 112-LQFP (20x20 mm) | — |
| Operating Voltage | 2.5 V core / 5.0 V I/O (typical) | — |
| ADC | 2 x 8-channel, 10-bit | 8-channel, 10-bit |
| PWM Channels | 8 | 8 channels |
| Enhanced Capture Timer Channels | 8 | — |
| SCI (UART) Interfaces | 2 (asynchronous) | — |
| GPIO / Digital I/O Lines | 20 discrete digital I/O lines | — |
| Temperature Grade | Industrial | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant (verify per lot) | Compliant |
| Debug Interface | Single-wire BDM (Background Debug Mode) | — |
| Level ng MSL | [DATA_NEEDED: MSL Level] | 3 (168 hours, JEDEC J-STD-020) |
| Lead-Free | Yes | — |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| Hanay ng Temperature na Operasyon | — | -40 °C to +85 °C (industrial) |
| Packhaging / Kaso | — | 112-LQFP (20 x 20 mm) |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| Timers | — | Enhanced Capture Timer (ECT) + watchdog |
| On-chip Debug | — | Background Debug Mode (BDM) |