MC9S12DT256VPVE vs MC9S12DG256CCPV 比較
詳細並排比較 MC9S12DT256VPVE 由 NXP Semiconductors 與 MC9S12DG256CCPV 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256VPVE NrndNXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV Nrnd規格比較
| 參數 | MC9S12DT256VPVE | MC9S12DG256CCPV |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | NRND |
| Core | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) |
| Maximum Bus Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB | 256 KB (256K x 8) |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| 封裝 | 112-LQFP (20x20 mm) | — |
| Operating Voltage | 2.5 V core / 5.0 V I/O (typical) | — |
| ADC | 2 x 8-channel, 10-bit | 8-channel, 10-bit |
| PWM Channels | 8 | 8 channels |
| Enhanced Capture Timer Channels | 8 | — |
| SCI (UART) Interfaces | 2 (asynchronous) | — |
| GPIO / Digital I/O Lines | 20 discrete digital I/O lines | — |
| Temperature Grade | Industrial | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | Compliant (verify per lot) | Compliant |
| Debug Interface | Single-wire BDM (Background Debug Mode) | — |
| MSL 等級 | [DATA_NEEDED: MSL Level] | 3 (168 hours, JEDEC J-STD-020) |
| Lead-Free | Yes | — |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| 工作溫度範圍 | — | -40 °C to +85 °C (industrial) |
| 封裝 / 外殼 | — | 112-LQFP (20 x 20 mm) |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| Timers | — | Enhanced Capture Timer (ECT) + watchdog |
| On-chip Debug | — | Background Debug Mode (BDM) |