MCF5307FT66B vs MCF5307AI66B Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MCF5307FT66B sa pamamagitan ng NXP Semiconductors at MCF5307AI66B sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MCF5307FT66B MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP

MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP

MCF5307FT66B Nrnd
NXP Semiconductors
MCF5307AI66B MCF5307AI66B - ColdFire V3 32-bit 66MHz MCU | NXP

MCF5307AI66B - ColdFire V3 32-bit 66MHz MCU | NXP

MCF5307AI66B ✗ Tapus ng Buhay

Pagsanggunian na paghahambing

Parametro MCF5307FT66B MCF5307AI66B
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle NRND Tapus ng Buhay
Core Architecture ColdFire V3 (MCF530x) —
Width ng Data Bus 32-bit —
Maksimum na Taktiko ng Oras 66 MHz —
Program Memory Type ROMless (external memory required) ROMless
On-chip SRAM 4 KB (4K x 8) —
Number of I/O Lines 16 —
Oscillator Type External —
Packhaging / Kaso 208-BFQFP (28x28 mm) —
Uri ng Pagpapasok Surface Mount Surface Mount
Volte ng Pagbibigay [DATA_NEEDED: VDD nominal - 3.3 V typical per family datasheet] [DATA_NEEDED: supply voltage range]
Temperature na Operasyon [DATA_NEEDED: temperature grade per device marking] [DATA_NEEDED: operating temperature range]
External Memory Controller Yes (ROM/SRAM/DRAM/Flash) —
DMA Channels [DATA_NEEDED: DMA channel count] —
Timers [DATA_NEEDED: timer module count] —
Serial Interfaces [DATA_NEEDED: UART/SPI/I2C instance count] —
Tindminan RoHS [DATA_NEEDED: per device marking] [DATA_NEEDED: RoHS status]
Packaging (distributor) Tray —
Core Processor — ColdFire V3 (MCF530x)
Core Size — 32-Bit
Maximum Clock Speed — 66 MHz
Performance — 70 MIPS
RAM Size — 4 KB SRAM
Connectivity — EBI/EMI, I2C, UART/USART
Peripherals — DMA, POR, WDT
Number of I/O — 16
DRAM Controller — Yes (integrated)
MAC Module — Yes (multiply-accumulate)
Packhaging — 208-FQFP (28x28 mm)
Part Status — End of Life / Not For New Designs

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