MPC8255AVVMHBB vs MPC8255ACZUMHBB Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MPC8255AVVMHBB sa pamamagitan ng NXP Semiconductors at MPC8255ACZUMHBB sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MPC8255AVVMHBB MPC8255AVVMHBB - PowerQUICC II 266MHz 32-Bit MPU | NXP

MPC8255AVVMHBB - PowerQUICC II 266MHz 32-Bit MPU | NXP

MPC8255AVVMHBB Obsolete
NXP Semiconductors
MPC8255ACZUMHBB MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP

MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP

MPC8255ACZUMHBB Obsolete

Pagsanggunian na paghahambing

Parametro MPC8255AVVMHBB MPC8255ACZUMHBB
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Obsolete Obsolete
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) NXP Semiconductors
Series PowerQUICC II (MPC82xx) PowerQUICC II HIP4
Core Architecture PowerPC G2, 32-bit PowerPC G2
Core Frequency 266 MHz —
Bus Frequency 133 MHz (core-to-memory bus) —
Number of Cores 1 1
Cache (I/D) 16 Kbyte instruction / 16 Kbyte data —
Packhaging 480-TBGA (37.5 x 37.5 mm, 1.27 mm pitch) —
Core Supply Voltage 1.8 V 1.8 V
I/O Supply Voltage 3.3 V —
Integrated Ethernet MAC 2x 10/100 Mbit/s (MII/RMII) —
PCI Interface Yes (32-bit, 66 MHz capable) —
CPM Serial Controllers HDLC/SDLC, UART, I2C, SPI, SCC/SMC —
Temperature na Operasyon -40C to +105C (extended, per 'MH' suffix) [DATA_NEEDED: operating temperature range]
Process Technology 0.18 micrometre CMOS 0.25 micron (HiP4) silicon revision
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Tindminan RoHS Non-compliant (NO-PB suffix - lead-bearing) [DATA_NEEDED: RoHS compliance status]
Lifecycle No Longer Manufactured (NXP) —
Width ng Data Bus — 64-Bit
Maximum Clock Speed — 266 MHz
Instruction Set — 32-Bit RISC
Core — MPC82xx
Package Type — T-BGA
Pin/Ball Count — 480
Package Size — 37.50 x 37.50 mm
Package Height — 1.55 mm
Ball Pitch — 1.27 mm
Integrated CPM — Yes (dual communications processor modules)
Ethernet MACs — Dual 10/100 MAC

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