MPC8255AVVMHBB vs MPC8255ACZUMHBB 比較

詳細並排比較 MPC8255AVVMHBB 由 NXP Semiconductors 與 MPC8255ACZUMHBB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8255AVVMHBB MPC8255AVVMHBB - PowerQUICC II 266MHz 32-Bit MPU | NXP

MPC8255AVVMHBB - PowerQUICC II 266MHz 32-Bit MPU | NXP

MPC8255AVVMHBB Obsolete
NXP Semiconductors
MPC8255ACZUMHBB MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP

MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP

MPC8255ACZUMHBB Obsolete

規格比較

參數 MPC8255AVVMHBB MPC8255ACZUMHBB
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 Obsolete Obsolete
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) NXP Semiconductors
Series PowerQUICC II (MPC82xx) PowerQUICC II HIP4
Core Architecture PowerPC G2, 32-bit PowerPC G2
Core Frequency 266 MHz —
Bus Frequency 133 MHz (core-to-memory bus) —
Number of Cores 1 1
Cache (I/D) 16 Kbyte instruction / 16 Kbyte data —
封裝 480-TBGA (37.5 x 37.5 mm, 1.27 mm pitch) —
Core Supply Voltage 1.8 V 1.8 V
I/O Supply Voltage 3.3 V —
Integrated Ethernet MAC 2x 10/100 Mbit/s (MII/RMII) —
PCI Interface Yes (32-bit, 66 MHz capable) —
CPM Serial Controllers HDLC/SDLC, UART, I2C, SPI, SCC/SMC —
工作溫度 -40C to +105C (extended, per 'MH' suffix) [DATA_NEEDED: operating temperature range]
Process Technology 0.18 micrometre CMOS 0.25 micron (HiP4) silicon revision
安裝類型 Surface Mount (BGA) Surface Mount
RoHS 狀態 Non-compliant (NO-PB suffix - lead-bearing) [DATA_NEEDED: RoHS compliance status]
Lifecycle No Longer Manufactured (NXP) —
資料匯流排寬度 — 64-Bit
Maximum Clock Speed — 266 MHz
Instruction Set — 32-Bit RISC
Core — MPC82xx
Package Type — T-BGA
Pin/Ball Count — 480
Package Size — 37.50 x 37.50 mm
Package Height — 1.55 mm
Ball Pitch — 1.27 mm
Integrated CPM — Yes (dual communications processor modules)
Ethernet MACs — Dual 10/100 MAC

資料表與資源

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