MPC8270CVRMIBA vs MPC8250ACZQIHBC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8270CVRMIBA sa pamamagitan ng NXP Semiconductors at MPC8250ACZQIHBC sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8270CVRMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8270CVRMIBA ✗ Tapus ng BuhayNXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoletePagsanggunian na paghahambing
| Parametro | MPC8270CVRMIBA | MPC8250ACZQIHBC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | Obsolete |
| Architecture | PowerPC G2_LE | — |
| Core | 1 Core, 32-Bit | — |
| Clock Speed | 266 MHz | 200 MHz |
| Width ng Data Bus | 64-Bit | 64-Bit |
| Supply Voltage (Core) | 1.5 V | 1.8 V |
| I/O Voltage | 3.3 V | — |
| Package Type | 516-PBGA (27 x 27 mm, 1 mm pitch) | TEPBGA / Plastic BGA |
| Series | PowerQUICC II (MPC82xx) | PowerQUICC II |
| Temperature na Operasyon | -40 C to +105 C | -40C to +105C (industrial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Integrated Peripherals | PCI (32-bit, v2.2), USB 2.0, HDLC, 3x 10/100 Ethernet MAC, I2C, UART | — |
| Process Node | 0.13 µm (HiP7) | — |
| Height (max) | 2.25 mm | — |
| Level ng MSL | [DATA_NEEDED: MSL moisture sensitivity level] | 3 (168 hours) |
| Tindminan RoHS | Lead-Free / Compliant (per package marking) | — |
| Ethernet Speed | 10/100 Mbps (3 ports) | — |
| USB Version | USB 2.0 | — |
| Product Status | End of Life (EOL) - Discontinuance issued | — |
| Manufacturer | — | NXP Semiconductors |
| Core Processor | — | PowerPC G2 |
| Core Architecture | — | PowerPC 603e, 32-Bit RISC |
| Number of Cores | — | 1 (CPU) + 1 CPM |
| Supply Voltage (I/O) | — | 3.3 V |
| Bilang ng Pin | — | 516 |
| Package Dimensions | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 0.25 um CMOS |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Lead Free | — | Yes (per datasheet package code) |