MPC8270VRMIBA vs MPC8250ACZQIHBC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8270VRMIBA sa pamamagitan ng NXP Semiconductors at MPC8250ACZQIHBC sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8270VRMIBA - PowerQUICC II 266MHz MPU | NXP | Networking
MPC8270VRMIBA ✗ Tapus ng BuhayNXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoletePagsanggunian na paghahambing
| Parametro | MPC8270VRMIBA | MPC8250ACZQIHBC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | Obsolete |
| Core Architecture | PowerPC G2_LE, 32-bit | PowerPC 603e, 32-Bit RISC |
| Core Frequency | 266 MHz | — |
| Series | PowerQUICC II (MPC82xx) | PowerQUICC II |
| Number of Cores | 1 | 1 (CPU) + 1 CPM |
| On-Chip Cache | 32 KB | — |
| Core Voltage | 1.45 V to 1.6 V | — |
| I/O Voltage | 3.3 V | — |
| Process Technology | HiPerMOS7, 0.13 micron | 0.25 um CMOS |
| Packhaging | 516-PBGA (27 x 27 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0 C to 105 C | -40C to +105C (industrial) |
| Integrated Peripherals | PCI, USB, HDLC, 10/100 Ethernet | — |
| Communications Module | CPM with multi-channel HDLC and ATM | — |
| PCI Interface | PCI 2.2 compliant | — |
| USB Interface | USB 1.1 (function or host with external PHY) | — |
| Ethernet MACs | Up to 3 x 10/100 Ethernet | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors |
| Core Processor | — | PowerPC G2 |
| Clock Speed | — | 200 MHz |
| Width ng Data Bus | — | 64-Bit |
| Supply Voltage (Core) | — | 1.8 V |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | TEPBGA / Plastic BGA |
| Bilang ng Pin | — | 516 |
| Package Dimensions | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Lead Free | — | Yes (per datasheet package code) |