MPC8270VRMIBA vs MPC8250ACZQIHBC Karşılaştırma
Ayrıntılı yan yana karşılaştırma MPC8270VRMIBA tarafından NXP Semiconductors ve MPC8250ACZQIHBC tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MPC8270VRMIBA - PowerQUICC II 266MHz MPU | NXP | Networking
MPC8270VRMIBA ✗ Son Kullanım ZamanıNXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoleteÖzellik Karşılaştırması
| Parametre | MPC8270VRMIBA | MPC8250ACZQIHBC |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Hayat Dönemi Sonu | Obsolete |
| Core Architecture | PowerPC G2_LE, 32-bit | PowerPC 603e, 32-Bit RISC |
| Core Frequency | 266 MHz | — |
| Series | PowerQUICC II (MPC82xx) | PowerQUICC II |
| Number of Cores | 1 | 1 (CPU) + 1 CPM |
| On-Chip Cache | 32 KB | — |
| Core Voltage | 1.45 V to 1.6 V | — |
| I/O Voltage | 3.3 V | — |
| Process Technology | HiPerMOS7, 0.13 micron | 0.25 um CMOS |
| Paket | 516-PBGA (27 x 27 mm) | — |
| Montaj Türü | Surface Mount | Surface Mount (BGA) |
| İşletim Sıcaklığı | 0 C to 105 C | -40C to +105C (industrial) |
| Integrated Peripherals | PCI, USB, HDLC, 10/100 Ethernet | — |
| Communications Module | CPM with multi-channel HDLC and ATM | — |
| PCI Interface | PCI 2.2 compliant | — |
| USB Interface | USB 1.1 (function or host with external PHY) | — |
| Ethernet MACs | Up to 3 x 10/100 Ethernet | — |
| MSL Seviyesi | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| RoHS Durumu | [DATA_NEEDED: RoHS status] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors |
| Core Processor | — | PowerPC G2 |
| Clock Speed | — | 200 MHz |
| Veri Bus Genişliği | — | 64-Bit |
| Supply Voltage (Core) | — | 1.8 V |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | TEPBGA / Plastic BGA |
| Pin Sayısı | — | 516 |
| Package Dimensions | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Lead Free | — | Yes (per datasheet package code) |