MPC8308CZQAGDA vs MPC8308CZQAGD Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8308CZQAGDA sa pamamagitan ng NXP Semiconductors at MPC8308CZQAGD sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8308CZQAGDA - PowerQUICC II Pro SoC 400MHz | NXP Semiconductors
MPC8308CZQAGDA ✗ Tapus ng BuhayNXP Semiconductors
MPC8308CZQAGD - PowerQUICC II Pro 400MHz SoC | NXP MAP-BGA
MPC8308CZQAGD ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MPC8308CZQAGDA | MPC8308CZQAGD |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | Aktibo |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II Pro | — |
| Core Processor | PowerPC e300c3 | — |
| Number of Cores | 1 | — |
| Core Architecture | 32-Bit Power Architecture | Power Architecture e300c3 |
| Maximum CPU Frequency | 400 MHz | 400 MHz |
| Packhaging / Kaso | 473-MAPBGA (19x19 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Hanay ng Temperature na Operasyon | -40C to +105C | -40C to +105C (Industrial) |
| Memory Controller | DDR2 (integrated) | DDR1/DDR2 |
| Integrated Ethernet | Dual Gigabit Ethernet MACs | — |
| PCI Express Support | Yes (integrated) | — |
| USB Support | USB 2.0 (integrated) | — |
| Part Status | End of Life (EOL) | — |
| Tindminan RoHS | Compliant | Compliant (lead-free) |
| Volte ng Pagbibigay | [DATA_NEEDED: core and I/O rail voltages] | — |
| L1 Instruction Cache | 16 KB | 16 KB |
| L1 Data Cache | 16 KB | 16 KB |
| Product Family | — | PowerQUICC II Pro (MPC8308) |
| Core Count | — | 1 |
| Width ng Data Bus | — | 32-bit |
| Integrated SRAM | — | 256 KB |
| Ethernet MACs | — | 2x 10/100/1000 Mbps (GMII/RGMII) |
| USB Controller | — | USB 2.0 High-Speed Host/Device/OTG |
| PCI Express | — | 1x PCIe endpoint |
| Communications Engine | — | QUICC Engine |
| Packhaging | — | 473-ball MAP-BGA (19x19) |
| Core Voltage | — | 1.0 V |
| I/O Voltages | — | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 0.09 um |
| Packaging Type | — | Tray |
| Level ng MSL | — | 3 |