MPC859TVR133A vs MPC866TZP133A Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MPC859TVR133A sa pamamagitan ng NXP Semiconductors at MPC866TZP133A sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MPC859TVR133A MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA

MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA

MPC859TVR133A ✗ Tapus ng Buhay
NXP Semiconductors
MPC866TZP133A MPC866TZP133A - MPC8xx PowerQUICC 133MHz BGA Processor | NXP

MPC866TZP133A - MPC8xx PowerQUICC 133MHz BGA Processor | NXP

MPC866TZP133A Obsolete

Pagsanggunian na paghahambing

Parametro MPC859TVR133A MPC866TZP133A
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Tapus ng Buhay Obsolete
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series PowerQUICC, MPC8xx family —
Core Architecture Power Architecture (32-bit) —
Core / Series Name MPC8xx —
Maksimum na Taktiko ng Oras 133 MHz —
Width ng Data Bus 32 bit —
Number of Cores 1 1 Core, 32-Bit
Package Type 357-PBGA (Plastic Ball Grid Array) —
Package Dimensions 25 x 25 mm —
Temperature na Operasyon 0C to +95C (commercial/industrial grade) 0 °C to +95 °C
On-Chip Cache 8 KB instruction / 8 KB data (per datasheet family) —
Communication Channels 4 SCC, 2 SMC, 1 FCC (typical MPC859T configuration) —
Peripheral Interfaces SPI, I2C, PCMCIA, IDMA, UART —
Uri ng Pagpapasok Surface Mount (BGA) —
Tindminan RoHS See manufacturer PCN (legacy status) Non-Compliant (contains lead - per datasheet)
Lifecycle End-of-Life per NXP product page —
Core Processor — MPC8xx Power Architecture (32-bit)
Core Speed — 133 MHz
External Bus Speed — 66 MHz
Co-Processors / DSP — Communications Processor Module (CPM)
Core Supply Voltage — 1.8 V
I/O Supply Voltage — 3.3 V (5 V TTL tolerant inputs)
Process Technology — 0.18 µm CMOS
Packhaging — 357-PBGA (25x25 mm, 1.0 mm pitch)
Ethernet MACs — 4 x 10/100 Mbps + 2 x 10 Mbps
RAM Controllers — DRAM (up to 16 banks), SRAM, EPROM, Flash
Graphics Acceleration — No
Lead Free Status — Contains Lead
Part Status — Obsolete
Packaging — Tray

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